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Writing with Pen

Call for Papers

ADCOM 2023 calls for original, high impact research papers and case studies on many aspects of Embedded AI systems and related technologies while seeking novel contributions that help identify challenges in the widespread deployment of such systems.

Researchers and practitioners are encouraged to submit original research contributions in all major areas, which include, but not limited to:

• Bringing AI, machine learning – deep learning, reinforcement learning etc. – to embedded devices and the network edge

• Defining edge requirements: intelligence, computing performance, connectivity

• Low power design

• Edge architectures and cloud connectivity

• Smart sensors, node-to-cloud platform topologies

• Energy harvesting

• RF technology at the edge

• Hardware Accelerators

• Neuromorphic Processors

• Reconfigurable Systems

• Mobile Embedded Systems

• Toolchains and development platforms

• Applications of Embedded AI in Automotive, telecom, defence and e-governance applications

• Security, privacy and regulatory aspects

• Case studies

Accepted and presented papers will be published as a conference proceedings

(https://digital-library.theiet.org/journals/conference-proceedings)

and best papers invited for submission to special issues of Scopus indexed journals (eg. Journal of Mobile Multimedia).

Important Dates

Technical Papers Sought by 30 September 2023

Acceptance Communicated by 30 October 2023

Full Papers due by 15 November 2023

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